JOB TITLE: SMT/TH Solder Assembler - 2nd Shift
LOCATION: Oldsmar, FL
PAY RATE: $27/hour
We are a national aerospace and defense staffing agency seeking highly qualified candidates for a position with a top-tier client.
Job Details:
Job Type: Contract (12 months with potential for extension)
Shift: 2nd Shift 3:30 PM 2:00 AM
Industry: Aerospace / Defense / Aviation
Benefits: Medical, dental, and vision (Cigna)
Perks: Bonus potential + Priority access via Tier 1 supplier
Openings Nationwide: Thousands of opportunities across the U.S.
Qualifying Questions:
Are you a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual) as defined under ITAR regulations?
Do you meet the educational and experience requirements for this role?
Can you commute to the job location or relocate if necessary?
Summary:
Perform high-mix SMT and through-hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.
Remove, replace, and rework components, including bottom-terminated devices such as:
QFNs (Quad Flat No-Lead)
BGAs (Ball Grid Arrays)
LGAs (Land Grid Arrays)
Utilize hot-air pencils, hot plates, reflow ovens, and specialized rework stations to perform precision soldering and component repair.
Conduct X-ray inspections of reworked components to evaluate solder joint integrity and verify workmanship quality.
Perform board-level verification and inspection, including:
Support functional testing and quality verification to ensure products meet engineering and manufacturing specifications.
Maintain cleanroom and ESD-controlled environments while monitoring equipment settings such as temperature, airflow, and process parameters.
Document inspection findings and support quality system requirements.
Participate in continuous improvement initiatives, recommend process enhancements, and assist in training junior assemblers.
Requirements:
Minimum 5 years of hands-on SMT and through-hole soldering experience in a high-mix, low-volume manufacturing environment (aerospace, defense, electronics manufacturing, or similar).
Experience with Surface-Mount Technology (SMT) and through-hole solder assembly and rework.
Strong experience removing, replacing, and repairing bottom-terminated devices, including:
QFNs (Quad Flat No-Lead)
BGAs (Ball Grid Arrays)
LGAs (Land Grid Arrays)
Proficiency using advanced soldering and rework equipment, including:
Experience with X-ray inspection, AOI, and visual inspection methods to verify solder joint integrity and workmanship quality.
Familiarity with IPC-A-610 and IPC-J-STD-001 standards.
Proficient using microscopes for inspection and precision soldering work.
Ability to read and interpret engineering drawings, work instructions, and technical documentation.
Experience working in cleanroom and ESD-controlled environments.
Strong attention to detail and commitment to quality workmanship.
Ability to support high-reliability aerospace and defense electronics manufacturing.
Must be a U.S. Person (as defined by ITAR).
